for Electronic Devices / Quartz Devices
Wafer Trimming Equipment SST-M01T
Flatten the wafer surface and remove irregularities with ion beam
We have an experimental equipment, and we accept equipment tours and experimental support.
General Outline
This wafer trimming equipment contributes to precision machining because it can flatten the unevenness of the wafer surface to σ = 1.0 nm or less by irradiating a φ4 inch or φ6 inch wafer with converged ion beam.
Features
- The load lock type keeps the trimming chamber in a vacuum at all times, so stability and reproducibility are high.
- Since the wafers are replaced in vacuum, there is almost no time loss due to waiting for transportation.
- Unique wafer alignment mechanism enables detection of wafer cracking and chipping before and after trimming.
- There is a lineup of grids for ion sources.
(For high rate, for high precision, for low cost, etc.)
- Various customizations in terms of hardware and software are possible according to the target wafer.
- Providing stable equipment operation through ion source take-back maintenance service.
Applications
SAW devices/BAW devices for 5G high-frequency filters, optical devices for optical communications, etc.,
(We are also conducting trimming experiments for applications other than those mentioned above, and we will verify whether or not SST-M01T can be used.)
Processable Material:Si, SiO₂, LT, LN, etc.
Processing example of SiO2 film (@ 600V)
Specifications
- Composition
- 4 chambers (cassette chamber, buffer chamber, aligner chamber, trimming chamber)
- Exhaust System
- Buffer chamber: Dry pump
Trimming chamber: Turbo molecular pump
- Vacuum Chamber
- Trimming chamber: W850mm × D510mm × H850mm
- Layout
- W4,000mm × D1,500mm × H2,300mm
- Equipment Weight
- 2,700 kg
*For the improvement of product, please understand that the specifications are subject to change without prior notice.
**This product may be applicable to export control products such as strategic raw materials which are regulated by the Foreign Exchange and Foreign Trade Control Law.
Accordingly when you bring out the applicable products outside Japan. You should take a necessary action such as application of an export permit to the Government of Japan.