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for Electronic Devices  (Sputtering & Ion Plating)

Single-wafer sputtering system SPM series

Single-wafer sputtering system SPM series

General Outline

Large-sized sputtering system compatible with 8-inch wafers.
Single-wafer type, suitable for continuous operation and mass production with cassette to cassette.
In order to suppress contamination from the target, we adopted the sputter UP method.

Features / Options

  1. 8 inch wafer compatible is available.
  2. Contamination reduction to the substrate is aimed at by sputtering UP method.
  3. Continuous operation by cassette to cassette is possible and suitable as a mass production device.
  4. Cleaning process is possible in the etching room.

Applications

Metal deposition on various wafer electronic components

Specifications

Processing method
Single-wafer type
Exhaust pump
DRP＋CP, TMP
Installation dimensions
W5,800㎜ × D3,700㎜ × H2,550㎜
Equipment weight
6,000 kg
Power supply capacity
AC200V（3φ）　/　69kVA（199A）
Vacuum tank size
Sputtering chamber: φ1,640㎜ × H410㎜

*For the improvement of product, please understand that the specifications are subject to change without prior notice.
**This product may be applicable to export control products such as strategic raw materials which are regulated by the Foreign Exchange and Foreign Trade Control Law. Accordingly when you bring out the applicable products outside Japan. You should take a necessary action such as application of an export permit to the Government of Japan.

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