Sputtering system capable of forming two types of films on both sides
Formation of metal films for electrodes on various electronic components
Low-temperature film formation
Enables low-temperature deposition at 130°C or lower, which is effective for measures such as preventing Cr spreading.
(Low temperature deposition is possible due to the short time of exposure to plasma.)
Exhaust Pump | Rotary pump+Cryo pump |
Installation Dimensions | W1,280㎜×D1,150㎜×H1,873㎜ |
Equipment Weight | 1,500kg |
Power Supply Capacity | AC200~220V / 17kVA(50A) |
*For the improvement of product, please understand that the specifications are subject to change without prior notice.
**This product may be applicable to export control products such as strategic raw materials which are regulated by the Foreign Exchange and Foreign Trade Control Law.
Accordingly when you bring out the applicable products outside Japan. You should take a necessary action such as application of an export permit to the Government of Japan.