Wafer Trimming Equipment
SST-M01T
Flatten the wafer surface and remove irregularities with ion beam
This equipment can flatten and smooth base materials (wafer and film formed on the surface) by irradiating a φ4”or φ6” wafer with a focused ion beam.
Applications
SAW devices/BAW devices for 5G high-frequency filters, optical devices for optical communications, etc.
Features
- 1. The load lock type keeps the trimming chamber in a vacuum at all times, so stability and reproducibility are high.
- 2. Since the wafers are replaced in vacuum, there is almost no time loss due to waiting for transportation.
- 3. Unique wafer alignment mechanism enables detection of wafer cracking and chipping before and after trimming.
- 4. There is a lineup of grids for ion sources. (For high rate, for high precision, for low cost, etc.)
- 5. Providing stable equipment operation through ion source take-back maintenance service.
Specifications
| Exhaust Pump | Buffer chamber: DRP／Trimming chamber: TMP |
|---|---|
| Installation Dimensions | W1,120mm×D3,870mm×H2,300mm |
| Weight | 2,700kg |
| Power Supply Capacity | AC200～220V(3Φ)／50/60Hz／17.8kVA(51.5A) |