Single-wafer Sputtering Equipment
SPM Series
Single-wafer large-sized sputtering equipment
Sputtering system compatible with 8-inch wafers. Single-wafer type, suitable for continuous operation and mass production with cassette to cassette. In order to suppress contamination from the target, we adopted the sputter UP method.
Applications
Metal deposition on various wafer electronic components
Features
- 1. 8 inch wafer compatible is available.
- 2. Contamination reduction to the substrate is aimed at by sputtering UP method.
- 3. Continuous operation by cassette to cassette is possible and suitable as a mass production device.
Options
An etching chamber (a cleaning room) ／ A heating chamber
Specifications
| Exhaust Pump | DRP＋CRYO、TMP |
|---|---|
| Installation Dimensions | W5,800mm×D3,700mm×H2,550mm |
| Weight | 6,000kg |
| Power Supply Capacity | AC200V(3φ)／69kVA(199A) |