In-line Sputtering Equipment
SPH-5000 Series
Sputtering equipment for mass production of large substrates
This system is an in-line sputtering system for depositing metal films, passivation films, ITO films, etc. on large substrates.
Applications
Thin film solar panel / Formation of various metal films and oxide films on large substrates
Features
- 1. A five-chamber configuration consisting of a loading chamber, a heating chamber, a sputtering chamber, a cooling chamber, and a removal chamber.
- 2. A maximum of 1,000mm x 1,400mm glass substrates can be transported.
- 3. Efficient film deposition is possible by gapless transport.
- 4. In the cooling chamber, substrate cooling by the cooling jacket is possible.
- 5. Pulsing unit is mounted on the sputtering power supply, and stable discharge is possible.
- 6. Pressure control with a differential pressure partition is adopted for the sputtering chamber, and oxide film and metal film can be formed in the same chamber.
- 7. Tact time: 90sec/piece (at the time of film formation by Ag:120nm, AZO:60nm)
- 8. A dedicated cart for target replacement is included.
- 9. Rotary cathode（optional）
Specifications
| Exhaust Pump | RP＋MBP＋TMP |
|---|---|
| Installation Dimensions | W20,000mm×D8,000mm×H2,000mm |
| Weight | 27,000kg |
| Power Supply Capacity | AC200V(3φ)／280kVA(800A) |