Load Lock Type Sputtering Equipment
SPH-2500T-Ⅱ
Sputtering equipment capable of forming two types of films on both sides
This system is a load lock type sputter equipment developed for the purpose of film formation of base electrode of quartz crystal.
The system consists of two chambers, a loading chamber and a film forming chamber, and is capable of fully automated processing from heating to film deposition and take-out.
”The base electrode deposition process” can be integrated into a production line, which contributes to improved productivity and labor savings. Simultaneous deposition on both sides for superior productivity.
Applications
Formation of metal films for electrodes on various electronic components
Features
- 1. Use target efficiency: about 40%.
- 2. Adopted a rack and pinion system to achieve stable conveyance.
- 3. DC bombard mechanism [for surface modification] （optional）
Specifications
| Exhaust Pump | RP＋TMP * Option: Cryo pump compatible |
|---|---|
| Installation Dimensions | W1,100mm×D3,640mm×H1,680mm |
| Weight | 1,900kg |
| Power Supply Capacity | AC200～220V(3Φ)／27kVA(78A) |
| Target Size | W126mm(5inch)×H178mm(7inch)×t6mm |