Load Lock Type Pass-Through Model Sputtering Equipment
SPH-2410-Ⅱ
Sputtering equipment capable of forming two types of films on both sides
This equipment is a load lock type pass-through type sputtering equipment developed for the purpose of film formation of base electrode of quartz crystal.
The system consists of two chambers, a loading chamber and a film forming chamber, and is capable of fully automated processing from heating to film deposition and take-out. ”The base electrode deposition process” can be integrated into a production line, which contributes to improved productivity and labor savings.
Applications
Formation of metal films for electrodes on various electronic components
Features
- 1. Compared with the SPH-2500T-II, the processing volume of one lot has been increased by about 1.5 times.
- 2. This is a system that can operate with high throughput time by simultaneous deposition on both sides.
- 3. Adopted a rack and pinion system to achieve stable conveyance.
Specifications
| Exhaust Pump | RP＋CRYO |
|---|---|
| Installation Dimensions | W1,100mm×D3,965mm×H1,280mm |
| Weight | 2,000kg |
| Power Supply Capacity | AC200～220V(3φ)／35kVA(99A) |
| Target Size | W126mm(5inch)×H253mm(10inch)×t6mm |