Plasma Cleaning Equipment
SPE-2136A
High throughput by simultaneous processing of two φ6-inch wafers
This equipment can descum, modificate the surface, and ash on φ4 to φ6inch wafers. In addition, it comes with an automatic transfer mechanism, which contributes to preventing wafer cracking and reducing the work time cost required for wafer transfer. Furthermore, the process room achieves high throughput by processing two wafers at the same time.
The equipment body size is W1,400mm x D2,000mm, which is a compact design.
Applications
Descum / Surface Modification / Resist stripping
Resist removal of various wafer electronic components, surface modification before post-process plating, organic pollutant removal, surface modification of resin material, for ultra-thin piezoelectric wafers such as SAW devices
Features
- 1. C to C
- 2. High throughput
- 3. Distribution: ±10% or less in the wafer (Si substrate)
- 4. Simultaneous processing of 2 sheets, low temperature processing
- 5. Ar plasma cleaning (optional)
- 6. Anti-static measures by ionizer (optional)
Specifications
| Exhaust Pump | DRP×1 |
|---|---|
| Installation Dimensions | Main Body：W1,340mm×D1,945mm×H1,870mm |
| Weight | 1,100Kg |
| Power Supply Capacity | AC200～220V(3φ)／50/60Hz／14.3kVA |