AuSn Vacuum Deposition Equipment
SEC-S900C
Thick films can be deposited at low temperatures by simultaneous Au/Sn dual source deposition.
Low-temperature deposition is possible through simultaneous Au/Sn 2-source deposition. In addition, composition ratio control and film thickness control of different materials are possible.
Applications
Au/Sn solder layer formation of LD submount
Au/Sn solder layer formation of LED thin film submount
Features
- 1. Low temperature deposition(Substrate cooling mechanism and intermittent deposition function included)
- 2. 2 source simultaneous deposition
- 3. Ion source (optional)
Specifications
| Exhaust Pump | RP＋MBP＋CP |
|---|---|
| Installation Dimensions | W1,520mm×D1,240mm×H2,790mm |
| Weight | Approx. 3,000kg |
| Power Supply Capacity | AC200～220V(φ3)／Approx.67kVA(193A) |