Vacuum Deposition Equipment for Plasma-resistant Films
SEC-S1300i
Thick Y₂O₃ film with high corrosion resistance can be deposited and shield film can be formed.
This equipment is capable of thick film deposition of plasma resistant film (Y₂O₃ film).
Ion-assisted deposition(IAD) can form dense, strong, corrosion-resistant Y₂O₃ films with high packing density.
Applications
Dry etcher for semiconductors
Shield coating on internal parts of CVD equipment
Features
- 1. Thick film deposition
- 2. RF Ion Source
Options
Ion plating / 2-ource simultaneous deposition / Self-rotating jig / Polyhedral dome
Specifications
Exhaust Pump | DP+RP+MBP(Meissner Trap) |
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Installation Dimensions | W4,500mm×D3,900mm×H2,720mm |
Weight | Approx. 4,500kg |
Power Supply Capacity | AC200~220V(φ3)/95kVA(275A) |