Atomic Layer Deposition Equipment

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Atomic Layer Deposition Equipment
ALD Series

Conformal coating on complex-shaped objects

Atomic Layer Deposition (ALD) has several advantages, “pin hole free”, “conformal coating", “precise thickness control”, and “small thickness variation”, over conventional CVD and PVD. And plasma enhanced ALD (PE-ALD) enables low temperature deposition over thermally fragile materials such as plastic.
■Films available：SiO2，TiO2，Al2O3

Applications

Optical coating on high curvature lens / Dielectric coatings for insulation purpose / Gas permeation barrier for various devices / Conformal coating on complex-shape objects

Principle of the ALD

Features

  1. 1. ALD enables Precise thickness control
  2. 2. Excellent step coverage
  3. 3. Low temperature coating(RT~120℃）
  4. 4. Uniform film thickness across the substrates
  5. 5. 24slices of 8inch substrate per batch
  6. 6. Substrate rotation during process

Specifications

Exhaust Pump TMP＋DRP
Installation Dimensions W3,200mm×D3,200×H2,600mm
Weight 1,200kg
Power Supply Capacity AC200V(3Φ)／39.5kVA(114A)
Product catalog