for Electronic Devices (Sputtering & Ion Plating)
Sputtering and Polymerization System SPP Series
integrated with Injection Molding
Outline
The new developed sputtering and polymerization system integrated with injection molding system SPP-SERIES enables fully automatic formation of metallic and protective films on resin substrates
used in the automobile and decoration industries.
Features
- Full automation
Fully automated system from injection molding to vacuum coating (sputtering and polymerization)
- High speed coating
Cycle time: 80 sec (Al: 100 nm + SiOx: 20 nm)
- High adhesion even without under coating
Applications
- Head lamp reflector / Mirror
- Decorative metal film
Specifications
- Substrate size (max.)
- W180 × L340 × D150 mm
- Substrate materials
- PC, PET, PP, PE, etc.
- Sputtering rate
- 10 nm/sec
- Polymerization rate
- 1 nm/sec
- Pumping speed
- within 30 sec from atmospheric pressure to 0.1 Pa
- Vacuum system
- RP + TMP
- Cycle time of production
- approx. 80 sec or less
from inputting substrate, through coating and polymerizing, to outputting
- Reflectance
- 85% or higher, KOH 1% 10min
- Chamber system
- 2 chambers system
(Sputtering chamber + Polymerization chamber)
- Sputtering chamber
- High efficiency type cathode (target size; 440 × 240 mm), 30kW DC power supply
- Polymerization chamber
- Polymerized electrode using glow discharge × 1, 750W RF power supply
- Sputter materials
- Al, etc.
- Polymerized gas
- HMDSO (for SiOx), etc.
*For the improvement of product, please understand that the specifications are subject to change without prior notice.
**This product may be applicable to export control products such as strategic raw materials which are regulated by the Foreign Exchange and Foreign Trade Control Law.
Accordingly when you bring out the applicable products outside Japan. You should take a necessary action such as application of an export permit to the Government of Japan.
