Sputter equipment capable of forming two types of films on both sides
This equipment is a load lock type sputter equipment developed for the purpose of film formation of base electrode of quartz crystal. Consists of two chambers （a loading chamber and a film forming chamber）, and by performing fully automatic interlocking from heating to film forming and taking out, it becomes possible to make the line of "base electrode film forming process" and improve productivity and save labor. High tact operation is possible due to simultaneous film formation on both sides.
DC bombard mechanism (for surface modification)
Formation of metal films for electrodes on various electronic components
| Exhaust Pump | Rotary Pump + Turbo Molecular Pump ※ Option: Cryo pump compatible |
| Installation dimensions | W1,100㎜×D3,640㎜×H1,680㎜ |
| Equipment Weight | 1,900kg |
| Power Supply capacity | AC200V～220V（3φ） / 27kVA（78A） |
*For the improvement of product, please understand that the specifications are subject to change without prior notice.
**This product may be applicable to export control products such as strategic raw materials which are regulated by the Foreign Exchange and Foreign Trade Control Law.
Accordingly when you bring out the applicable products outside Japan. You should take a necessary action such as application of an export permit to the Government of Japan.
