Descum / Surface Modification / Ashing Treatment
High-tact model for simultaneous processing of two 6-inch wafers
This equipment can descum, modificate the surface, and ash on φ4 to φ6 inch wafers. In addition, it comes with an automatic transfer mechanism, which contributes to preventing wafer cracking and reducing the work time cost required for wafer transfer. Furthermore, the process room achieves high throughput by processing two wafers at the same time. The equipment body size is W1,400 mm x D2,000 mm, which is a compact design.
(1)Consists of a transport area equipped with a transport robot and an ashing room
(2)The vacuum chamber material is made of A5052 that has been degreased.
Pumping System | set of dry pump |
External Dimensions | Equipment Body:W1340mm×D1945mm×H1870mm |
Equipment Weight | 1,000Kg |
Electric Power | 200V 3φ 50/60Hz 14.3KVA |
*For the improvement of product, please understand that the specifications are subject to change without prior notice.
**This product may be applicable to export control products such as strategic raw materials which are regulated by the Foreign Exchange and Foreign Trade Control Law.
Accordingly when you bring out the applicable products outside Japan. You should take a necessary action such as application of an export permit to the Government of Japan.