for Electronic Devices (Sputtering & Ion Plating)
Vacuum evaporation system SEC-22C
Standard model of metal thin film deposition device
Electrode film and oxide film can be formed on φ4 inch and φ6 inch wafers. The incident angle of the deposition material is configured to be vertical so that it can correspond to the lift-off process. Moreover, in order to stabilize the incident angle in a substrate dome more, the high-precision dome is adopted.
Features
- High-speed exhaust 20 minutes to 4.0 x 10-4 Pa
- Realized film thickness distribution of ± 1.0% or less (φ4 inch wafer surface)
- Perpendicular incidence of deposition materials suitable for lift-off applications is possible. (Incidence angle ± 5 degrees (φ 6 inches))
- Able to form a film on resist pattern without damage by low temperature deposition process
- Equipped with 4 types of correction plates, it is possible to adjust the film thickness distribution of 4 materials.
- Realized high rate of Al deposition. (3 times that of our previous model)
- Compatible with thick film processes such as Au-Sn solder
- Recipe setting management and acquisition of logging are possible.
- The mounting board has a structure that can be maintained with minimal replacement work.
- Cleaning treatment before film formation is possible by installing an ion source (optional)
Effective for removal of natural oxide film, removal of organic matter, surface modification, etc.
- Assist vapor deposition during film formation is possible by installing an ion source (optional)
Effective for improving adhesion, controlling stress, controlling film quality, etc.
Options
Equipped with a substrate cleaning mechanism
Substrate cooling mechanism (cooling dome)
Planetary jig (rotation and revolution jig)
Applications
- Electrode film formation of various electronic parts
- Electrode formation corresponding to lift-off process
- Oxide film formation such as protective film application
Outline
| Pumping System |
Cryo pump, Dry pump, Mechanical booster pump |
| Vacuum Chamber |
W800 mm × D800 mm × H1300 mm, made of SUS304 |
| Footprint |
W2500 mm × D4300 mm × H2800 mm |
| Required Electricity |
Equipment proper: Φ3 200 V AC, Approx. 40 kVA (115 A)
Vapor source: Φ3 200 V AC, Approx. 25 kVA (73 A)
|
*For the improvement of product, please understand that the specifications are subject to change without prior notice.
**This product may be applicable to export control products such as strategic raw materials which are regulated by the Foreign Exchange and Foreign Trade Control Law.
Accordingly when you bring out the applicable products outside Japan. You should take a necessary action such as application of an export permit to the Government of Japan.
