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for Electronic Devices  (Sputtering & Ion Plating)

Ion Beam Sputtering equipment  SPI series

Ion Beam Sputtering equipment SPI series

Outline

This equipment is the ion beam sputtering system to form some thin films on electronic devices using high vacuum.
Load lock mechanism maintains high vacuum in a sputtering chamber, and Transfer robot achieves space saving.
It is also equipped with Φ11cm ion guns for sputtering and assisting, which are adjustable in angle taking low incidence angle into consideration by a pentahedron target. Optional magnetron sputtering chamber contributes high-precision and high-efficient production.

Features

  1. Ultra-high vacuum (6.7 × 10-7Pa or less)
  2. Low rate
  3. Ultra-thin film
  4. Stable growth of a magnetic film

Specifications

  1. Load lock, C to C
  2. Five sets of 10-inch cathodes
  3. Ion guns (one set each for sputtering and assist)
  4. Pumps: Cryo pump, dry pump
  5. Wafer size: up to Φ6 inch

*For the improvement of product, please understand that the specifications are subject to change without prior notice.
**This product may be applicable to export control products such as strategic raw materials which are regulated by the Foreign Exchange and Foreign Trade Control Law. Accordingly when you bring out the applicable products outside Japan. You should take a necessary action such as application of an export permit to the Government of Japan.

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